Process technology and integration challenges for high performance interconnects

Author： Sandhu G.S.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.320, Iss.1, 1998-05, pp. : 1-9

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Facile Preparation of High‐Performance Elastically Stretchable Interconnects

By  

ADVANCED MATERIALS, Vol. 27, Iss. 25, 2015-07 ,pp. : 3755-3759

John Wiley & Sons Inc

Access to resources Recommend Favorite

Stretchable Electronics: Facile Preparation of High‐Performance Elastically Stretchable Interconnects (Adv. Mater. 25/2015)

By  

ADVANCED MATERIALS, Vol. 27, Iss. 25, 2015-07 ,pp. : 3709-3709

John Wiley & Sons Inc

Access to resources Recommend Favorite

The integration of spectroscopic and process data for enhanced process performance monitoring

By  

THE CANADIAN JOURNAL OF CHEMICAL ENGINEERING, Vol. 86, Iss. 5, 2008-10 ,pp. : 905-923

John Wiley & Sons Inc

Access to resources Recommend Favorite

The Integration of Process R&D in Drug Discovery - Challenges and Opportunities

By  

Combinatorial Chemistry & High Throughput Screening, Vol. 9, Iss. 2, 2006-01 ,pp. : 79-86

Bentham Science Publishers

Access to resources Recommend Favorite

Future Dielectric Materials for CNT Interconnects - Possibilities and Challenges

By  

Journal of Nano Research, Vol. 2018, Iss. 52, 2018-07 ,pp. : 21-42

Trans Tech Publications

Access to resources Recommend Favorite