Author: Lu J.P. Hsu W.Y. Hong Q.Z. Dixit G.A. Luttmer J.D. Havemann R.H. Chen P.J. Tsai H.L. Magel L.K.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.320, Iss.1, 1998-05, pp. : 20-25
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Thermal stability of AlSiCu/W/n + p diodes with and without TiN barrier layer
By Yeh W.-K. Chen M.-C. Wang P.-J. Liu L.-M. Lin M.-S.
Thin Solid Films, Vol. 270, Iss. 1, 1995-12 ,pp. :
Thermal Stability of Al-Si-Cu-Mg Cast Alloys Modified with Transition Metals Zr, V and Ti
Materials Science Forum, Vol. 2015, Iss. 828, 2015-09 ,pp. :
Thermal stability of TiN/AlN superlattices
By Setoyama M. Irie M. Ohara H. Tsujioka M. Takeda Y. Nomura T. Kitagawa N.
Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. :
Oriented wedge-like hillocks on Al-0.5 wt.%Cu/TiN/SiO 2 /Si multilayer structure
By Wang P. Hwang J. Chuang A. Huang F.-S.
Thin Solid Films, Vol. 358, Iss. 1, 2000-01 ,pp. :
Stresses in Al/TiW/Si(100) contacts during thermal cycling
Thin Solid Films, Vol. 333, Iss. 1, 1998-11 ,pp. :