Co-sputter deposited Ta-Si diffusion barrier between Si and Cu: the effects of Si content on the barrier property

Author: Lee Y.-J.   Suh B.-S.   Park C.-O.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.357, Iss.2, 1999-12, pp. : 237-241

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Abstract