Stress evolution of Ni/Pd/Si reaction system under isochronal annealing

Author: Tsai C.J.   Chung P.L.   Yu K.H.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.365, Iss.1, 2000-04, pp. : 72-76

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Abstract