Author： Bruckner W. Thomas J. Schneider C.M.
Publisher： Elsevier
ISSN： 0040-6090
Source： Thin Solid Films, Vol.385, Iss.1, 2001-04, pp. : 225-229
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
Stress evolution during isochronal annealing of Ni/Si system
Thin Solid Films, Vol. 350, Iss. 1, 1999-08 ,pp. :
Stress development in FeAl8 thin films during heat treatment
By Zeiger W. Bruckner W. Schumann J. Pitschke W. Worch H.
Thin Solid Films, Vol. 370, Iss. 1, 2000-07 ,pp. :
Stress relaxation during annealing of boron nitride films
By Fitz C. Kolitsch A. Fukarek W.
Thin Solid Films, Vol. 389, Iss. 1, 2001-06 ,pp. :
Microstructure and residual stress of very thin Mo films
By Adams D.P. Parfitt L.J. Bilello J.C. Yalisove S.M. Rek Z.U.
Thin Solid Films, Vol. 266, Iss. 1, 1995-09 ,pp. :