Rate-limiting steps during nitrogen incorporation in furnace-grown silicon oxynitrides: effects on wafer-to-wafer uniformity

Author: Dang S.S.   Takoudis C.G.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.366, Iss.1, 2000-05, pp. : 225-231

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Abstract