The origin of intrinsic stress and its relaxation for SiOF thin films deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition

Author: Kim S.P.   Choi S.K.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.379, Iss.1, 2000-12, pp. : 259-264

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