Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects

Author: Moriyama M.   Kawazoe T.   Tanaka M.   Murakami M.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.416, Iss.1, 2002-09, pp. : 136-144

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Abstract