Effect of sputtering gas pressure and nitrogen concentration on crystal orientation and residual stress in sputtered AlN films

Author: Kusaka K.   Taniguchi D.   Hanabusa T.   Tominaga K.  

Publisher: Elsevier

ISSN: 0042-207X

Source: Vacuum, Vol.66, Iss.3, 2002-08, pp. : 441-446

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Abstract