The kinetic H/D isotope effect in electroless copper plating. An EQCM study

By Jusys Z.   Stalnionis G.   Juzeliunas E.   Vaskelis A.  

Electrochimica Acta, Vol. 43, Iss. 3, 1998-01 ,pp. : 301-308

Elsevier

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Theoretical study on the scattering resonance state and isotope effect of the F + HD(H₂) → HF + D(H) reactive system

By Yue Hong   Lu Xi   Cai Zhengting   Sun Xiaomin  

Canadian Journal of Chemistry, Vol. 87, Iss. 5, 2009-05 ,pp. : 684-687

NRC Research Press

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Copper hydride formation in the electroless copper plating process: in situ X-ray diffraction evidence and electrochemical study

By Vaskelis A.   Juskenas R.   Jaciauskiene J.  

Electrochimica Acta, Vol. 43, Iss. 9, 1998-04 ,pp. : 1061-1066

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Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol, D-mannitol and D-sorbitol as copper(II) ligands

By Norkus E.   Vaškelis A.   Jačiauskiene J.   VaičIuniene J.   Gaidamauskas E.   Macalady D.  

Journal of Applied Electrochemistry, Vol. 35, Iss. 1, 2005-01 ,pp. : 41-47

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Electroless plating of polymers: XPS study of the initiation mechanisms

By Charbonnier M.   Alami M.   Romand M.  

Journal of Applied Electrochemistry, Vol. 28, Iss. 4, 1998-04 ,pp. : 449-453

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