Immersion plating of copper using (CF 3 SO 3 ) 2 Cu onto porous silicon from organic solutions

Author： Harraz F.A.   Sakka T.   Ogata Y.H.  

Publisher： Elsevier

ISSN： 0013-4686

Source： Electrochimica Acta, Vol.46, Iss.18, 2001-05, pp. : 2805-2810

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