Effect of chloride ions on immersion plating of copper onto porous silicon from a methanol solution

Author: Harraz F.A.   Sakka T.   Ogata Y.H.  

Publisher: Elsevier

ISSN: 0013-4686

Source: Electrochimica Acta, Vol.47, Iss.8, 2002-02, pp. : 1249-1257

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Abstract