Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements

Author: Bonou L.   Eyraud M.   Denoyel R.   Massiani Y.  

Publisher: Elsevier

ISSN: 0013-4686

Source: Electrochimica Acta, Vol.47, Iss.26, 2002-10, pp. : 4139-4148

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Abstract