Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

By Tsai M.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2528-2535

Springer Publishing Company

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Critical Current Density for Inhibiting (Cu,Ni) 6 Sn 5 Formation on the Ni Side of Cu/Solder/Ni Joints

By Wu W.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2653-2661

Springer Publishing Company

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Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests

By Zhang Ning  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2536-2543

Springer Publishing Company

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Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints

By Chuang Tung-Han  

Journal of Electronic Materials, Vol. 40, Iss. 1, 2011-01 ,pp. : 71-77

Springer Publishing Company

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Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints

By Liu Chao  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1912-1920

Springer Publishing Company

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