Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements

Author: Eyraud M.   Kologo S.   Bonou L.   Massiani Y.  

Publisher: Springer Publishing Company

ISSN: 1385-3449

Source: Journal of Electroceramics, Vol.16, Iss.1, 2006-02, pp. : 55-63

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Abstract