Journal of Electroceramics,volume 16,issue 1  (02-2014)

Period of time： 2014年1期

Publisher： Springer Publishing Company

Founded in： 1997

Total resources： 55

ISSN： 1385-3449

Subject： TM Electrotechnical

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Journal of Electroceramics,volume 16,issue 1

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Preface

By Knauth Philippe,Djenizian Thierry,Schmuki Patrik in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 5-7

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Electron beam lithographic techniques and electrochemical reactions for the micro- and nanostructuring of surfaces under extreme conditions

By Djenizian T.,Schmuki P. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 9-14

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Controlled growth of silicon nanowires on silicon surfaces

By Salhi Billel,Grandidier Bruno,Boukherroub Rabah in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 15-21

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Morphology of porous n -GaP anodically formed in different mineral acids

By Wloka J.,Schmuki P. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 23-28

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Influence of different fluoride containing electrolytes on the formation of self-organized titania nanotubes by Ti anodization

By Macak J.,Taveira L.,Tsuchiya H.,Sirotna K.,Macak J.,Schmuki P. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 29-34

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Initiation of tantalum oxide pores grown on tantalum by potentiodynamic anodic oxidation

By Sieber I.,Hildebrand H.,Friedrich A.,Schmuki P. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 35-39

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Corrosion performance of lamellae nanostructured fluorinated organic coating applied on steel

By Roche V.,Vacandio F. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 41-47

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Semiconductive behavior of passive films formed on Fe-Cr alloy

By Tsuchiya Hiroaki,Fujimoto Shinji,Shibata Toshio in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 49-54

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Effect of additives on Cu electrodeposits: electrochemical study coupled with EQCM measurements

By Eyraud M.,Kologo S.,Bonou L.,Massiani Y. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 55-63

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Potential influence on copper electrodeposition on scratched silicon surfaces

By Zhang Y.,Balaur E.,Schmuki P. in (2006)

Journal of Electroceramics,volume 16,issue 1 , Vol. 16, Iss. 1, 2006-02 , pp. 65-70

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