Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2588-2597

Springer Publishing Company

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Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

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Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1895-1902

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Viscoplastic Creep Response and Microstructure of As-Fabricated Microscale Sn-3.0Ag-0.5Cu Solder Interconnects

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Journal of Electronic Materials, Vol. 39, Iss. 10, 2010-10 ,pp. : 2292-2309

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Defect Imaging in Laser Diodes by Mapping Their Near-Infrared Emission

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Journal of Electronic Materials, Vol. 39, Iss. 6, 2010-06 ,pp. : 723-726

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A Transmission Electron Microscopy Study of Microstructure Evolution with Increasing Anneal Temperature in Ti/Al Ohmic Contacts to n-GaN

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Journal of Electronic Materials, Vol. 30, Iss. 3, 2001-03 ,pp. : 283-286

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