Effect of thin film coating of Au on joint strength in invar-invar packages

Author： Wang S.   Wang C.   Wang C.   Chang H.   Tu Y.   Hwang C.   Chi S.   Wang W.   Yang Y.   Cheng W.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.25, Iss.11, 1996-11, pp. : 1797-1800

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