The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

Author： Sigelko J.   Choi S.   Subramanian K.   Lucas J.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.29, Iss.11, 2000-11, pp. : 1307-1311

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