Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films

Author: Fang R.   Gu H.   O'Keefe M.   O'Keefe T.   Shih W.   Leedy K.   Cortez R.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.30, Iss.4, 2001-04, pp. : 349-354

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Abstract