A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation

Author: Fu Guanghui   Chandra Abhijit  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.30, Iss.4, 2001-04, pp. : 400-408

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract