Size and Substrate Effects upon Undercooling of Pb-Free Solders
Author： Huang Yu-chih
Publisher： Springer Publishing Company
ISSN： 1543-186X
Source： Journal of Electronic Materials, Vol.39, Iss.1, 2010-01, pp. : 109-114
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
