Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper

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Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1956-1961

Springer Publishing Company

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Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique

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Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 425-430

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

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Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 362-374

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Microstructural Variation and Phase Evolution in the Reaction of Sn- x Ag-Cu Solders and Cu- y Zn Substrates During Reflow

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Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2627-2635

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Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

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