Microstructural Variation and Phase Evolution in the Reaction of Sn- x Ag-Cu Solders and Cu- y Zn Substrates During Reflow

By Yu Chi-Yang  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2627-2635

Springer Publishing Company

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Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

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Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 97-104

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Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates

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Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2720-2731

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Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System

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Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 189-194

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Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

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Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 791-799

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