Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C

By Wang Chao-hong  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2375-2381

Springer Publishing Company

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Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni

By Harcuba Petr  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2553-2557

Springer Publishing Company

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Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples

By Chen Sinn-wen  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2418-2428

Springer Publishing Company

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Interfacial Reactions in Sn-Co-(Cu)/Ni Couples With/Without Current Stressing

By Chen Chih-ming  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3205-3214

Springer Publishing Company

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Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys

By Zhou Haifei  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3161-3168

Springer Publishing Company

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