Relationships between mechanical strength and electrical conductivity for Cu–Ag filamentary microcomposites

Author: Liu J.B.   Zhang L.   Meng L.  

Publisher: Springer Publishing Company

ISSN: 0947-8396

Source: Applied Physics A, Vol.86, Iss.4, 2007-03, pp. : 529-532

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract