Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging

Author: Cui Hui-wang   Fan Qiong   Li Dong-sheng   Tang Xin  

Publisher: Taylor & Francis Ltd

ISSN: 0021-8464

Source: Journal of Adhesion, Vol.89, Iss.1, 2013-01, pp. : 19-36

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