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Taylor & Francis Ltd

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Hydrodynamic analysis of chemical mechanical polishing process

By Park S.-S.   Cho C.-H.   Ahn Y.  

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Chemical mechanical polishing of tantalum: oxidizer and pH effects

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Chemical Mechanical Polishing in Elastic Contact and Partial Hydrodynamic Lubrication: Modeling and Experiments

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Influence of a Retaining Ring on Strain and Stress in the Chemical Mechanical Polishing Process

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