A multifunctional test chip for microelectronic packaging and its application on RF property measurements

Author：

ISSN： 1362-3060

Source： International Journal of Electronics, Vol.94, Iss.6, 2007-06, pp. : 633-643

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Test chip and substrate design for flip chip microelectronic package thermal measurements

By Goh Teck Joo Chiu Chia-Pin Seetharamu K.N. Quadir G.A. Zainal Z.A.

Microelectronics International, Vol. 23, Iss. 2, 2006-05 ,pp. : 3-10

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

CMOS blocks for on-chip RF test

By Ramzan Rashad

Analog Integrated Circuits and Signal Processing, Vol. 49, Iss. 2, 2006-11 ,pp. : 151-160

Springer Publishing Company

Access to resources Recommend Favorite

Fully integrated circuit chip of microelectronic neural bridge

By Xiaoyan Shen Zhigong Wang

Journal of Semiconductors, Vol. 35, Iss. 9, 2014-09 ,pp. : 95011-95014

IOP Publishing

Access to resources Recommend Favorite

Tomorrow's Packaging - Chip Scale Packaging vs Flip Chip*

By Boustedt K Vardaman** E.J.

Microelectronics International, Vol. 14, Iss. 3, 1997-03 ,pp. : 31-32

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Substrate integrated packaging for RF-applications

By Richter H Ferling D Buchali F Heck W

Microelectronics International, Vol. 17, Iss. 1, 2000-01 ,pp. : 31-36

Emerald Group Publishing Ltd

Access to resources Recommend Favorite