The Impact of Thermal Contact Conductance on the Spreading and Solidification of a Droplet on a Substrate

Author: Wang W.   Hong F.   Qiu H.   Cheng P.  

Publisher: Taylor & Francis Ltd

ISSN: 1521-0537

Source: Heat Transfer Engineering, Vol.27, Iss.9, 2006-11, pp. : 68-80

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Abstract