Adhesion between Ni/Fe lead frame and epoxy molding compounds in IC packages

Author： Asai SHIN'ICHIRO   Ando Takayuki   Tobita Masayuki  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.10, Iss.1, 1996-01, pp. : 1-15

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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