Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment

Author： Iwamori Satoru Miyashita Takehiro Fukuda Shin Nozaki Shouhei Sudoh Kazufuyu Fukuda Nobuhiro

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.11, Iss.6, 1997-01, pp. : 783-795

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