Pressure-dependent conduction behavior of various particles for conductive adhesive applications

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Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

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Silver coating of spindle- and filament-type magnetic particles for conductive adhesive applications

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Journal of Adhesion Science and Technology, Vol. 11, Iss. 8, 1997-01 ,pp. : 1105-1118

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Effects of various adherend surface treatments on fatigue behavior of joints bonded with a silver-filled electronically conductive adhesive

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Use of polymeric emeraldine salt for conductive adhesive applications

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