Synthesis of polyimides containing triazole to improve their adhesion to copper substrate

Author: Seo Jeonghoon   Kang Jeonghoon   Cho Kilwon   Park Chan Eon  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.16, Iss.13, 2002-12, pp. : 1839-1851

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Abstract