Debond behavior of copper fibers in thermoset matrices and their effect on fracture toughening

Author： Bagwell Renee M.   Wetherhold Robert C.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.17, Iss.16, 2003-12, pp. : 2223-2242

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