Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings

By Roh J. H.   Lee J. H.   Yoon T. H.  

Journal of Adhesion Science and Technology, Vol. 16, Iss. 11, 2002-11 ,pp. : 1529-1543

Taylor & Francis Ltd

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Study of heat of reaction between plasma-polymer-coated silica fillers and biphenyl epoxy resin

By Kim N.I.   Kang H.M.   Yoon T.H.  

Journal of Adhesion Science and Technology, Vol. 18, Iss. 12, 2004-12 ,pp. : 1325-1338

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Pull-out behavior of oxidized copper leadframes from epoxy molding compounds

By Lee Ho-Young   Kim Sung-Ryong  

Journal of Adhesion Science and Technology, Vol. 16, Iss. 6, 2002-05 ,pp. : 621-651

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Effects of oxidation and plasma cleaning on the adhesion strength of molding compounds to copper leadframes

By Sung Yi  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 7, 1999-01 ,pp. : 789-804

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Thermal stabilities and mechanical properties of epoxy molding compounds (EMC) containing encapsulated red phosphorous

By Kim J.   Yoo S.   Bae J.-Y.   Yun H.-C.   Hwang J.   Kong B.-S.  

Polymer Degradation and Stability, Vol. 81, Iss. 2, 2003-01 ,pp. : 207-213

Elsevier

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