Plasma surface modification of poly(phenylene sulfide) films for copper metallization

By Inagaki Norihiro   Narushima Kazuo   Morita Masahiro  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 9, 2006-06 ,pp. : 917-938

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Surface modification of polyimide film surface by silane coupling reactions for copper metallization

By Inagaki N.   Tasaka S.   Baba T.  

Journal of Adhesion Science and Technology, Vol. 15, Iss. 7, 2001-07 ,pp. : 749-762

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Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma

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Plasma modification of diamond surfaces

By Hahn Manuela   Pleul Dieter   Nitschke Mirko   Frens Gerrit   Bundel Garance   Prause Silvio   Simon Frank  

Journal of Adhesion Science and Technology, Vol. 19, Iss. 12, 2005-10 ,pp. : 1039-1052

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Surface modification of poly(tetrafluoroethylene) films by plasma polymerization and UV-induced graft copolymerization for adhesion enhancement with electrolessly-deposited copper

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