An energy-based failure criterion for delamination initiation in electronic packaging

Author: Fan Hai Bo   Chung Paular W. K.   Yuen Matthew M. F.   Chan Philip C. H.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.19, Iss.15, 2005-12, pp. : 1375-1386

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Abstract