Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles

Author： Lin Yung-Sen

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.22, Iss.14, 2008-09, pp. : 1673-1697

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