Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis

By Lin Y. C.   Chen X.   Wang Z. P.  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 12, 2006-09 ,pp. : 1383-1399

Taylor & Francis Ltd

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Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

By Lin Y. C.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1631-1657

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Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

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Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1717-1731

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Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives

By Teo Mary  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 1003-1015

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Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film

By Kim Jong-Woong   Jung Seung-Boo  

Journal of Adhesion Science and Technology, Vol. 21, Iss. 11, 2007-09 ,pp. : 1071-1087

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