A generalized stress singularity approach for material failure prediction and its application to adhesive joint strength analysis

By Van Tooren M. J. L.   Krakers L. A.  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 9, 2006-06 ,pp. : 981-995

Taylor & Francis Ltd

Access to resources Recommend Favorite

Vacuum-based picking-up of thin chip from adhesive tape

By Xu Zhoulong   Liu Zunxu   Huang YongAn   Chen Jiankui   Liu Huimin   Yin Zhouping  

Journal of Adhesion Science and Technology, Vol. 29, Iss. 13, 2015-07 ,pp. : 1315-1329

Taylor & Francis Ltd

Access to resources Recommend Favorite

Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method

By Cheng Tung-Hua   Tseng Ching-Huan   Hung Ching-Hua  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 15, 2006-11 ,pp. : 1669-1692

Taylor & Francis Ltd

Access to resources Recommend Favorite

Rubber-like adhesive in simple shear: stress analysis and fracture morphology of a single lap joint

By Pascal J.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 5, 1994-01 ,pp. : 553-573

Taylor & Francis Ltd

Access to resources Recommend Favorite

Comparative Study of the Results of Various Experimental Tests Used for the Analysis of the Mechanical Behaviour of an Adhesive in a Bonded Joint

By J. Y. Cognard  

Journal of Adhesion Science and Technology, Vol. 25, Iss. 20, 2011-11 ,pp. : 2857-2879

Taylor & Francis Ltd

Access to resources Recommend Favorite