Use of Organic Metal to enhance the operating window and solderability of immersion tin

ISSN： 0305-6120

Source： Circuit World, Vol.25, Iss.4, 1999-04, pp. : 8-16

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Intermetallic compound formation and solderability for immersion tin

By Chan C.M. Tong K.H. Kwok R.W.M.

Circuit World, Vol. 32, Iss. 4, 2006-12 ,pp. : 3-8

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Immersion tin: a proven final finish for printed circuit boards providing reliable solderability and marginal formation of tin-whiskers

By Meeh Peter

Circuit World, Vol. 31, Iss. 1, 2004-09 ,pp. : 28-40

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Solderability Preservative Coatings: Electroless Tin vs Organic Azoles

By Artaki I. Ray U. Jackson A.M. Gordon H.M. Vianco P.T.

Circuit World, Vol. 20, Iss. 3, 1993-12 ,pp. : 23-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The new immersion tin generation in practical operation - a surface finish process including the world's first organic metal

By Schröder Sabine

Circuit World, Vol. 29, Iss. 1, 2003-01 ,pp. : 10-13

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The advantages of mildly alkaline immersion silver as a final finish for solderability

By Fang Jing Li Chan Daniel K.

Circuit World, Vol. 33, Iss. 2, 2007-05 ,pp. : 43-51

Emerald Group Publishing Ltd

Access to resources Recommend Favorite