Imprint patterning: a novel method for producing high density interconnects

By Gregoire George  

Circuit World, Vol. 28, Iss. 4, 2002-08 ,pp. : 33-37

Emerald Group Publishing Ltd

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Development of a new, more efficient and environmentally friendly method of producing high density interconnects - the "PRIME" process

By Albin David   Rames Jean-Claude   Dietel Claudia   Lenfert Kai   Rossi Stephanie   Starkey David   Down Joel   Pineda Ricard   Sardon Juan Carlos   Goosey Martin   Graves John   Bains Narinder   Cristoph Frank   Smeets Frank   Gilen Willy  

Circuit World, Vol. 27, Iss. 2, 2001-01 ,pp. : 12-16

Emerald Group Publishing Ltd

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ED photo resist technology becomes a manufacturing process

By Hertlein Walter G.   Törnkvist Kent   Smith Kevin  

Circuit World, Vol. 27, Iss. 3, 2001-09 ,pp. : 6-15

Emerald Group Publishing Ltd

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Integrated waveguides for optical interconnects

By Sweatman Denis   Powell Olly   Francis Shinoj  

Circuit World, Vol. 32, Iss. 2, 2006-05 ,pp. : 3-7

Emerald Group Publishing Ltd

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The Adhesion Promotion and Metallisation Process: The Critical Step in MID Manufacturing

By Hunter P.  

Circuit World, Vol. 21, Iss. 3, 1993-12 ,pp. : 28-32

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