Micro via filling plating technology for IC substrate applications

Author： Yeh Cheng-Ching   Lan Kuo-Hsing   Dow Wei-Ping   Hsu Jui-Hsia   Lee Cliff   Hsu Chih-Hao   Lee Ken   Chen Jordan   Lu Philip  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.30, Iss.3, 2004-09, pp. : 26-32

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