Development of an electroless nickel immersion gold process for PCB final finishes

Author： Kwok R.W.M.   Chan K.C.M.   Bayes M.W.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.30, Iss.3, 2004-09, pp. : 37-42

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Factors influencing the formation of "black pad" in electroless nickel-immersion gold solderable finishes-a processing perspective

By Goosey Martin  

Circuit World, Vol. 28, Iss. 3, 2002-03 ,pp. : 36-39

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

ITRI project on electroless nickel/immersion gold joint cracking

By Houghton F.D. Bruce  

Circuit World, Vol. 26, Iss. 2, 2000-02 ,pp. : 10-16

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Direct immersion gold (DIG) as a final finish

By Hashimoto Shigeo   Kiso Masayuki   Oda Yukinori   Otake Horoshi   Milad George   Gudaczauskas Don  

Circuit World, Vol. 32, Iss. 1, 2006-01 ,pp. : 16-22

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

By Hetschel Thomas   Wolter Klaus-Jürgen   Phillipp Fritz  

Circuit World, Vol. 35, Iss. 2, 2009-05 ,pp. : 37-44

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Nickel-gold plating of copper PCB traces and signal losses

By Gaudion Martyn  

Circuit World, Vol. 38, Iss. 2, 2012-05 ,pp. : 64-67

Emerald Group Publishing Ltd

Access to resources Recommend Favorite