An investigation of the recommended immersion tin thickness for lead-free soldering

ISSN： 0305-6120

Source： Circuit World, Vol.31, Iss.2, 2005-02, pp. : 15-21

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder

By Hetschel Thomas Wolter Klaus-Jürgen Phillipp Fritz

Circuit World, Vol. 35, Iss. 2, 2009-05 ,pp. : 37-44

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

De-mystifying materials selection for lead-free soldering

By Chen Casper Chiang Joshua Lee F.Y.

Circuit World, Vol. 32, Iss. 2, 2006-05 ,pp. : 18-22

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Soldering considerations for lead-free printed circuit board assembly ‐ an Envirowise Guide

By Goosey Martin

Circuit World, Vol. 31, Iss. 3, 2005-09 ,pp. : 40-44

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Printed circuit boards for lead-free soldering: materials and failure mechanisms

By Johander Per Tegehall Per-Erik Osman Abelrahim Ahmed Wetter Göran Andersson Dag

Circuit World, Vol. 33, Iss. 2, 2007-05 ,pp. : 10-16

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Minimization of tin whisker formation for lead-free electronics finishing

By Schetty Rob

Circuit World, Vol. 27, Iss. 2, 2001-01 ,pp. : 17-20

Emerald Group Publishing Ltd

Access to resources Recommend Favorite