Solderability of electroless deposited Ni-P coatings with Sn-3.8Ag-0.7Cu and Sn-3.5Ag lead-free solder alloys

Author： Li Dezhi   Liu Changqing   Conway Paul P.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.31, Iss.3, 2005-09, pp. : 32-39

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