Dual metal core multilayer boards (MLBS) ‐ a better option for high speed spacecraft electronic packaging applications

Author： Rao C. Hanumanth Varghese Jissy Suresh A. Baliga B.N.

ISSN： 0305-6120

Source： Circuit World, Vol.32, Iss.2, 2006-05, pp. : 30-38

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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