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Circuit World, Vol. 31, Iss. 4, 2005-12 ,pp. : 21-24

Emerald Group Publishing Ltd

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New materials and challenges in build-up, RF and high speed applications - an overview

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Circuit World, Vol. 29, Iss. 4, 2003-07 ,pp. : 28-33

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Market trends of sequential build-up (SBU) printed wiring boards (PWB) in Japan

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Circuit World, Vol. 27, Iss. 3, 2001-09 ,pp. : 15-18

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Specially developed glass fabrics for ultimate small diameter holes of high density board by build-up method

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Circuit World, Vol. 27, Iss. 1, 2001-01 ,pp. : 13-19

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Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

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Circuit World, Vol. 28, Iss. 2, 2002-06 ,pp. : 32-38

Emerald Group Publishing Ltd

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