Development of a standard test method for evaluating conductive anodic filament (CAF) growth failure in PCBs

By Navarro Clarissa  

Circuit World, Vol. 28, Iss. 2, 2002-06 ,pp. : 14-18

Emerald Group Publishing Ltd

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Conductive filament formation failure in a printed circuit board

By Rogers Keith   Hillman Craig   Pecht Michael   Nachbor Suzanne  

Circuit World, Vol. 25, Iss. 3, 1999-03 ,pp. : 6-8

Emerald Group Publishing Ltd

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A variant of conductive filament formation failures in PWBs with 3 and 4?mil spacings

By Rogers Keith L.   Pecht Michael G.  

Circuit World, Vol. 32, Iss. 3, 2006-09 ,pp. : 11-18

Emerald Group Publishing Ltd

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Microstructure of Conductive Anodic Filaments Formed during Accelerated Testing of Printed Wiring Boards

By Ready W.J.   Stock S.R.   Freeman G.B.     Turbini L.J.  

Circuit World, Vol. 21, Iss. 4, 1993-12 ,pp. : 5-9

Emerald Group Publishing Ltd

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Factors influencing the formation of "black pad" in electroless nickel-immersion gold solderable finishes-a processing perspective

By Goosey Martin  

Circuit World, Vol. 28, Iss. 3, 2002-03 ,pp. : 36-39

Emerald Group Publishing Ltd

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